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  transistors 1 publication date: november 2002 sjc00107bed 2SC1518 silicon npn epitaxial planar type for high-frequency bias oscillation of tape recorders for dc-dc converter features ? low collector-emitter saturation voltage v ce(sat) ? satisfactory operation performances and high efficiency with a low- voltage power supply absolute maximum ratings t a = 25 c parameter symbol rating unit collector-base voltage (emitter open) v cbo 25 v collector-emitter voltage (base open) v ceo 20 v emitter-base voltage (collector open) v ebo 5v collector current i c 1a peak collector current i cp 1.5 a collector power dissipation p c 1w junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c parameter symbol conditions min typ max unit collector-base voltage (emitter open) v cbo i c = 10 a, i e = 025v collector-emitter voltage (base open) v ceo i c = 1 ma, i b = 020v emitter-base voltage (collector open) v ebo i e = 10 a, i c = 05v collector-base cutoff current (emitter open) i cbo v cb = 25 v, i e = 0 100 na collector-emitter cutoff current (base open) i ceo v ce = 20 v, i b = 01 a forward current transfer ratio h fe1 * v ce = 2 v, i c = 500 ma 90 330 ? h fe2 v ce = 2 v, i c = 1 a 50 100 ? collector-emitter saturation voltage v ce(sat) i c = 1 a, i b = 5 0 ma 0.5 v base-emitter saturation voltage v be(sat) i c = 500 ma, i b = 50 ma 1.2 v transition frequency f t v cb = 10 v, i e = ? 50 ma, f = 200 mhz 150 mhz collector output capacitance c ob v cb = 10 v, i e = 0, f = 1 mhz 12 20 pf (common base, input open circuited) electrical characteristics t a = 25 c 3 c note) 1. measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. 2. * : rank classification 5.9 0.2 0.7 0.1 4.9 0.2 8.6 0.2 0.7 +0.3 ?0.2 13.5 0.5 2.54 0.15 (3.2) (1.27) (1.27) 0.45 +0.2 ?0.1 0.45 +0.2 ?0.1 13 2 unit: mm 1: emitter 2: collector 3: base eiaj: sc-51 to-92l-a1 package rank q r s h fe1 90 to 155 130 to 220 185 to 330
2SC1518 2 sjc00107bed i c ? i b v be(sat) ? i c i c ? v be(sat) p c ? t a i c ? v ce v ce(sat) ? i c h fe ? i c f t ? i e c ob ? v cb 0 160 40 120 80 0 1.2 1.0 0.8 0.6 0.4 0.2 collector power dissipation p c ( w ) ambient temperature t a ( c ) 010 8 26 4 0 1.2 1.0 0.8 0.6 0.4 0.2 i b = 5.0 ma 4.5 ma 4.0 ma 3.5 ma 3.0 ma 2.5 ma 2.0 ma 1.5 ma 1.0 ma 0.5 ma t a = 25 c collector current i c ( a ) collector-emitter voltage v ce ( v ) 0.01 0.1 1 10 0.01 0.1 1 10 100 i c / i b = 20 t a = 75 c 25 c ? 25 c collector-emitter saturation voltage v ce(sat) ( v ) collector current i c ( a ) 05 4 13 2 0 1.0 0.8 0.6 0.4 0.2 v ce = 2 v t a = 25 c base current i b ( ma ) collector current i c ( a ) 0.01 0.1 1 10 0.01 0.1 1 10 100 i c / i b = 10 t a = ? 25 c 25 c 75 c base-emitter saturation voltage v be(sat) ( v ) collector current i c ( a ) 0 1.0 0.8 0.2 0.6 0.4 0 1.6 1.2 0.4 1.0 1.4 0.8 0.2 0.6 t a = 25 c i c / i b = 20 10 base-emitter saturation voltage v be(sat) ( v ) collector current i c ( a ) 0.01 0.1 1 10 0 600 500 400 300 200 100 v ce = 2 v t a = 75 c 25 c ? 25 c forward current transfer ratio h fe collector current i c ( a ) ? 1 ? 10 ? 100 0 200 160 120 80 40 180 140 100 60 20 v cb = 10 v t a = 25 c transition frequency f t ( mhz ) emitter current i e ( ma ) 110100 0 50 40 30 20 10 i e = 0 f = 1 mhz t a = 25 c collector-base voltage v cb ( v ) collector output capacitance (common base, input open circuited) c ob (pf)
2SC1518 3 sjc00107bed i cbo ? t a i ceo ? t a safe operation area 0160 40 120 80 140 20 100 60 1 10 10 2 10 3 10 4 v cb = 25 v ambient temperature t a ( c ) i cbo ( t a ) i cbo ( t a = 25 c ) 0 160 40 120 80 140 20 100 60 1 10 10 2 10 3 10 5 10 4 v ce = 20 v ambient temperature t a ( c ) i ceo ( t a ) i ceo ( t a = 25 c ) 0.1 1 10 100 0.01 10 1 0.1 single pulse t a = 25 c t = 50 ms dc i cp i c collector current i c ( a ) collector-emitter voltage v ce ( v )
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteris- tics and applied circuits examples of the products. it neither warrants non-infringement of intellec- tual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) the products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage, and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2002 jul


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